through_hole_plating
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— | through_hole_plating [2013/08/13 12:13] (current) – created - external edit 127.0.0.1 | ||
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+ | ===== **Through hole plating of PCBs by acid copper.** ===== | ||
+ | **Constant current, pulse and reverse pulse processes** | ||
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+ | The current calculation were a little off, hence the bumpy plating in the hole.]] | ||
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+ | {{: | ||
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+ | [[http:// | ||
+ | [[http:// | ||
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+ | ==== Formula: | ||
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+ | < | ||
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+ | .881 lb of crystal (CuS04)to each gallon of DI water | ||
+ | .4 gal 35% sulfuric acid (H2SO4) | ||
+ | .5ml hydrochloric acid (HCL) | ||
+ | PEG 10mg/L leveler (found as laxative at RiteAid) | ||
+ | Janus Green B as brigtner | ||
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+ | -Can push about 25amps per sqft but we have been using 8amp/sqft as the plating seems brighter and more level | ||
+ | -With a little agitation it seems we can push 10amps/sqft with out diminishing brightness. | ||
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+ | ==== Power Supply | ||
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+ | DIY TPM | ||
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+ | ==== Concepts and Research | ||
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+ | Pulse and pulse reverse plating—Conceptual, | ||
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+ | Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History | ||
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+ | The Theory behind Pulse Plating Reversal Current | ||
+ | {{:rp theory.pdf}} | ||
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through_hole_plating.txt · Last modified: 2013/08/13 12:13 by 127.0.0.1