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**Through hole plating of PCBs by acid copper.**

Constant current, pulse and reverse pulse processes

thumb|early attempt with powdered carbon for hole activation

thumb|sample after we figured out levelers and brightening

thumb|microscope shot of hole, after plating.  
The current calculation were a little off, hence the bumpy plating in the hole.]]



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 .881 lb of crystal (CuS04)to each gallon of DI water
 .4 gal 35% sulfuric acid (H2SO4)
 .5ml hydrochloric acid (HCL)
 PEG 10mg/L leveler (found as laxative at RiteAid)
 Janus Green B as brigtner
 -Makes about 1.5gal
 -Can push about 25amps per sqft but we have been using 8amp/sqft as the plating seems brighter and more level
 -With a little agitation it seems we can push 10amps/sqft with out diminishing brightness.
 -Light sanding after activation is very important (1000 grit sandpaper)

Power Supply


Concepts and Research

 Pulse and pulse reverse plating—Conceptual, advantages and applications

 Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History

 Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating
 The Theory behind Pulse Plating Reversal Current
 {{:rp theory.pdf}}

 Prototype of the Pulse Plating controller.

 [[|Another plating setup]]
through_hole_plating.txt · Last modified: 2013/08/13 12:13 by