through_hole_plating
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| + | ===== **Through hole plating of PCBs by acid copper.** ===== | ||
| + | **Constant current, pulse and reverse pulse processes** | ||
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| + | The current calculation were a little off, hence the bumpy plating in the hole.]] | ||
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| + | [[http:// | ||
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| + | ====  Formula:  | ||
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| + | .881 lb of crystal (CuS04)to each gallon of DI water | ||
| + | .4 gal 35% sulfuric acid (H2SO4) | ||
| + | .5ml hydrochloric acid (HCL) | ||
| + | PEG 10mg/L leveler (found as laxative at RiteAid) | ||
| + | Janus Green B as brigtner | ||
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| + | -Can push about 25amps per sqft but we have been using 8amp/sqft as the plating seems brighter and more level | ||
| + | -With a little agitation it seems we can push 10amps/sqft with out diminishing brightness. | ||
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| + | ====  Power Supply  | ||
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| + | DIY TPM | ||
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| + | ====  Concepts and Research  | ||
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| + |  Pulse and pulse reverse plating—Conceptual, | ||
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| + | Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History | ||
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| + | The Theory behind Pulse Plating Reversal Current | ||
| + | {{:rp theory.pdf}} | ||
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through_hole_plating.txt · Last modified:  by 127.0.0.1
                
                