===== **Through hole plating of PCBs by acid copper.** =====
**Constant current, pulse and reverse pulse processes**
{{:throughholepcb0.jpg|thumb|early attempt with powdered carbon for hole activation}}
{{:throughholeplate1.jpg|thumb|sample after we figured out levelers and brightening}}
{{:thourhgholeplated2.jpg|thumb|microscope shot of hole, after plating.
The current calculation were a little off, hence the bumpy plating in the hole.]]
{{:throughholeplate3.jpg|none|400px|caption}}
{{:throughholeplate4.jpg|none|400px|caption}}
[[http://www.flickr.com/photos/nullspacelabs/sets/72157625578867973/|More Pics]]
[[http://www.flickr.com/search/?q=nsl+plating&m=tags|Pics tagged 'NSL plating']]
==== Formula: ====
**Ingredients:**
.881 lb of crystal (CuS04)to each gallon of DI water
.4 gal 35% sulfuric acid (H2SO4)
.5ml hydrochloric acid (HCL)
PEG 10mg/L leveler (found as laxative at RiteAid)
Janus Green B as brigtner
**Tips:**
-Makes about 1.5gal
-Can push about 25amps per sqft but we have been using 8amp/sqft as the plating seems brighter and more level
-With a little agitation it seems we can push 10amps/sqft with out diminishing brightness.
-Light sanding after activation is very important (1000 grit sandpaper)
==== Power Supply ====
DIY TPM
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine2.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine3.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine4.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine5.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine6.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine7.html
==== Concepts and Research ====
Pulse and pulse reverse plating—Conceptual, advantages and applications
{{:ea-v53-8-p3313.pdf}}
Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History
{{:0611.pdf}}
Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating
http://dx.doi.org/10.1149/1.2189238
The Theory behind Pulse Plating Reversal Current
{{:rp theory.pdf}}
Prototype of the Pulse Plating controller.
{{:platingcontroller.jpg}}
[[http://www.youtube.com/watch?feature=player_embedded&v=KTNuTv_IQp4|Another plating setup]]