===== **Through hole plating of PCBs by acid copper.** ===== **Constant current, pulse and reverse pulse processes** {{:throughholepcb0.jpg|thumb|early attempt with powdered carbon for hole activation}} {{:throughholeplate1.jpg|thumb|sample after we figured out levelers and brightening}} {{:thourhgholeplated2.jpg|thumb|microscope shot of hole, after plating. The current calculation were a little off, hence the bumpy plating in the hole.]] {{:throughholeplate3.jpg|none|400px|caption}} {{:throughholeplate4.jpg|none|400px|caption}} [[http://www.flickr.com/photos/nullspacelabs/sets/72157625578867973/|More Pics]] [[http://www.flickr.com/search/?q=nsl+plating&m=tags|Pics tagged 'NSL plating']] ==== Formula: ==== **Ingredients:** .881 lb of crystal (CuS04)to each gallon of DI water .4 gal 35% sulfuric acid (H2SO4) .5ml hydrochloric acid (HCL) PEG 10mg/L leveler (found as laxative at RiteAid) Janus Green B as brigtner **Tips:** -Makes about 1.5gal -Can push about 25amps per sqft but we have been using 8amp/sqft as the plating seems brighter and more level -With a little agitation it seems we can push 10amps/sqft with out diminishing brightness. -Light sanding after activation is very important (1000 grit sandpaper) ==== Power Supply ==== DIY TPM http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine.html http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine2.html http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine3.html http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine4.html http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine5.html http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine6.html http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine7.html ==== Concepts and Research ==== Pulse and pulse reverse plating—Conceptual, advantages and applications {{:ea-v53-8-p3313.pdf}} Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History {{:0611.pdf}} Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating http://dx.doi.org/10.1149/1.2189238 The Theory behind Pulse Plating Reversal Current {{:rp theory.pdf}} Prototype of the Pulse Plating controller. {{:platingcontroller.jpg}} [[http://www.youtube.com/watch?feature=player_embedded&v=KTNuTv_IQp4|Another plating setup]]