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through_hole_plating

**Through hole plating of PCBs by acid copper.**

Constant current, pulse and reverse pulse processes

thumb|early attempt with powdered carbon for hole activation

thumb|sample after we figured out levelers and brightening

thumb|microscope shot of hole, after plating.  
The current calculation were a little off, hence the bumpy plating in the hole.]]

{{:throughholeplate3.jpg|none|400px|caption

none|400px|caption

More Pics Pics tagged 'NSL plating'

Formula:

 **Ingredients:**
 .881 lb of crystal (CuS04)to each gallon of DI water
 .4 gal 35% sulfuric acid (H2SO4)
 .5ml hydrochloric acid (HCL)
 PEG 10mg/L leveler (found as laxative at RiteAid)
 Janus Green B as brigtner
 **Tips:**
 -Makes about 1.5gal
 -Can push about 25amps per sqft but we have been using 8amp/sqft as the plating seems brighter and more level
 -With a little agitation it seems we can push 10amps/sqft with out diminishing brightness.
 -Light sanding after activation is very important (1000 grit sandpaper)

Power Supply

 DIY TPM
 http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine.html
 http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine2.html
 http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine3.html
 http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine4.html
 http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine5.html
 http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine6.html
 http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine7.html

Concepts and Research

 Pulse and pulse reverse plating—Conceptual, advantages and applications
 {{:ea-v53-8-p3313.pdf}}

<code>
 Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History
 {{:0611.pdf}}

<code>
 Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating
 http://dx.doi.org/10.1149/1.2189238
 The Theory behind Pulse Plating Reversal Current
 {{:rp theory.pdf}}

<code>
 Prototype of the Pulse Plating controller.
 {{:platingcontroller.jpg}}


<code>
 [[http://www.youtube.com/watch?feature=player_embedded&v=KTNuTv_IQp4|Another plating setup]]
through_hole_plating.txt · Last modified: 2013/08/13 12:13 (external edit)