Through hole plating

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Through hole plating of PCBs by acid copper.

Constant current, pulse and reverse pulse processes

Early attempt with powdered carbon for hole activation
Sample after we figured out levelers and brightening
Microscope shot of hole, after plating. The current calculation were a little off, hence the bumpy plating in the hole.
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First real attempt at PCB with plated through holes.
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Plating tank (Fish tank with copper tubing)

More Pics Pics tagged 'NSL plating'

Formula:

Ingredients:
.881 lb of crystal (CuS04)to each gallon of DI water
.4 gal 35% sulfuric acid (H2SO4)
.5ml hydrochloric acid (HCL)
PEG 10mg/L leveler (found as laxative at RiteAid)
Janus Green B as brigtner
Tips:
-Makes about 1.5gal
-Can push about 25amps per sqft but we have been using 8amp/sqft as the plating seems brighter and more level
-With a little agitation it seems we can push 10amps/sqft with out diminishing brightness.
-Light sanding after activation is very important (1000 grit sandpaper)

Power Supply

DIY TPM
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine2.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine3.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine4.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine5.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine6.html
http://www.dioda.ro/tutorial/TroughHole_MZingg/Welcome%20to%20the%20homebrew%20through%20plating%20machine7.html

Concepts and Research

Pulse and pulse reverse plating—Conceptual, advantages and applications
File:EA-v53-8-p3313.pdf
Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History
File:0611.pdf
Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating
http://dx.doi.org/10.1149/1.2189238
The Theory behind Pulse Plating Reversal Current
File:RP theory.pdf
Prototype of the Pulse Plating controller.
PlatingController.jpg


Another plating setup
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